STATS ChipPAC Inc.

Technology

Meeting Objectives

Connect with industry partners, customers, and stakeholders to strengthen relationships within the semiconductor ecosystem in the automotive markets, engage with participants to exchange insights on technology trends, supply chain dynamics, and market opportunities, and expand visibility while identifying potential collaborations that support growth across key markets and regions.

Organization Profile

Currently leading government relations at STATS ChipPAC the international subsidiary of the world’s #3 leading #semiconductor advanced packaging group with operations in all major markets, to advance corporate missions in strategic countries to grow sales and improve our customer service and experience. A leading supplier of automotive semiconductor advanced packaging solutions with top global and US customers and OEMs customers. We are vital to keep supply chains flowing.